Method for producing a data carrier
AssigneeGiesecke & Devrient GmbH
InventorsYahya Haghiri-Tehrani, Albert Ojster, Achim Oertel
Life of this patent
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Abstract
In a multilayer data carrier, an electronic module is provided in a corresponding opening or gap in at least one layer. For filling the remaining cavity after installation of the module in the gap, one provides on a layer adjacent the gap or on the layer containing the gap or directly on the electronic module a material preferably applied by printing technology and having a softening point lower than the softening point of the layer.
Claims14
A method for producing a multi-layered data carrier carrying an electronic module, comprising the steps of:
- providing at least a first and a second layer (4,11,21), the first layer having at least one opening therein (20,18,23),
- positioning an electronic module (8a,8b,2 or 15a,15b,14) in the opening in the first layer such that there remains a cavity between the module and one side of the opening,
- printing a filling material (7,16,19) on the second layer selectively in the area of said side of the opening of the first layer including the cavity, the softening temperature of the filling material being lower than the softening temperature of the at least first and second layers, and
- laminating at least first and second layers and filling material under heat sufficient to soften the at least first and second layers, and pressure such that the filling material is caused to soften and flow at least partly into the cavity remaining between the electronic module and the opening before said at least first and second layers are softened and laminated.
A method for producing a multi-layered data carrier carrying an electronic module, comprising the steps of:
- providing at least a first and second layer (4,11,21) having at least one opening therein (20,18,23),
- printing a filling material (7,16,19) on at least one surface of an electronic module (150,156), the softening temperature of the filling material being lower than the softening temperature of said at least first and second layers,
- positioning the electronic module (15a, 15b, 14) in the opening in the first layer such that there remains a cavity between the module and one side of the opening, and
- laminating at least first and second layers and the filling material under heat sufficient to soften the at least first and second layers, and pressure such that the filling material is caused to soften and flow at least partly into the cavity remaining between the electronic module and the opening before the at least first and second layers are softened and laminated.
Dependencies are inferred from the claim text.