Method of attaching a die onto a pad of a lead frame
AssigneeSamsung Electronics Co., Ltd.
InventorsHwa Young Lee, Jong Keun Jun, Tae Hyuk Kim, Jae Won Lee
Life of this patent
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Abstract
An improved method of attaching a semiconductor chip onto a die pad of a lead frame using an epoxy adhesive by dispensing the epoxy adhesive onto the die pad, decreasing a viscosity of the epoxy adhesive dispensed onto the die pad by blowing a hot gas over at least part of the epoxy adhesive thereby preventing a formation of an epoxy tail, and placing the chip into the adhesive to attach the chip to the die pad. The hot gas used may be air or nitrogen, having a temperature from 50.degree. C. to 70.degree. C. The hot gas is blown from a blower between the die pad and the dispenser, and may be blown onto the epoxy adhesive from more than one direction.
Claims15
A method of attaching a semiconductor chip onto a die pad of a lead frame using an epoxy adhesive, comprising the steps of:
- dispensing the epoxy adhesive onto the die pad;
- decreasing a viscosity of the epoxy adhesive dispensed onto the die pad by blowing a hot gas over at least part of the epoxy adhesive thereby preventing a formation of an epoxy tail, while preventing the hot gas from being blown directly onto the die pad;
- and
- placing the chip into the adhesive to attach the chip to the die pad.
An improved method of attaching a semiconductor chip onto a die pad of a lead frame using an epoxy adhesive, comprising the steps of:
- dispensing a plurality of dots of the epoxy adhesive onto the die pad;
- decreasing a viscosity of the plurality of dots of epoxy adhesive by blowing a hot gas over at least part of the plurality of dots thereby preventing a formation of epoxy tails, while preventing the hot gas from being blown directly onto the die pad;
- and
- placing the chip into the plurality of dots of epoxy adhesive to attach the chip to the die pad.
Dependencies are inferred from the claim text.