Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board

In a wiring structure with metal wiring layers and polyimide layers, the improvement wherein each of said polyimide layers is a layer which has been formed by heating and curing a resin composition comprising a polyimide precursor, an amine compound and an organic solvent;

• said resin composition containing said amine compound in an equivalent amount 0.5-2 times as much as carboxyl groups in said polyimide precursor and said organic solvent amounts to 50-90 wt. % of the entire amount of said resin composition, wherein said amine compound is represented by any one of the following formulae (4), (5) and (9):
• ##STR15## wherein R.sup.1 represents an alkylene group having 1-6 carbon atoms, ##STR16## wherein R.sup.2 represents an alkylene group having 1-6 carbon atoms, and ##STR17## wherein R.sup.11, R.sup.12, and R.sup.13 individually represents a hydrogen atom or a group selected from a C.sub.1-4 alkyl group, a phenyl group or a vinyl group, R.sup.14 represents an alkylene group. R.sup.15 represents a group selected from a C.sub.1-4 alkyl group, a phenyl group or a vinyl group, i+j=3, and i=1 to 3.

A wiring structure comprising a metal wiring layer and a polyimide layer, wherein said polyimide layer is a layer which has been formed by heating and curing a resin composition comprising a polyimide precursor, an amine compound and an organic solvent;

• said resin composition containing said amine compound in an equivalent amount of 0.5-2 times as much as carboxyl groups in said polyimide precursor and said organic solvent amounts to 50-90 wt. % of the entire amount of said resin composition, wherein said amine compound is represented by any one of the following formulae (4), (5) and (9):
• Formula (4) ##STR18## wherein R.sup.1 represents an alkylene group having 1-6 carbon atoms, ##STR19## wherein R.sup.2 represents an alkylene group having 1-6 carbon atoms, and ##STR20## wherein R.sup.11, R.sup.12, and R.sup.13 individually represents a hydrogen atom or a group selected from a C.sub.1-4 alkyl group, a phenyl group or a vinyl croup, R.sup.14 represents an alkylene group. R.sup.15 represents a group selected from a C.sub.1-4 alkyl group, a phenyl group or a vinyl group, i+j=3, and i =1 to 3.

A wiring structure comprising a metal wiring layer and a polyimide layer, wherein said polyimide layer is a layer which has been formed by heating and curing a resin composition comprising a polyimide precursor, an amine compound and an organic solvent, and wherein said amine compound is represented by any one of the following formulae (4), (5) and (9):

• ##STR21## wherein R.sup.1 represents an alkylene group having 1-6 carbon atoms,
• Formula (5) ##STR22## wherein R.sup.2 represents an alkylene group having 1-6 carbon atoms, and ##STR23## wherein R.sup.11, R.sup.12, and R.sup.13 individually represents a hydrogen atom or a group selected from a C.sub.1-4 alkyl group, a phenyl group or a vinyl group, R.sup.14 represents an alkylene group, R.sup.15 represents a group selected from a C.sub.1-4 alkyl group, a phenyl group or a vinyl group, i+j=3, and i=1 to 3.