Semiconductor wafer processing adhesives and tapes
AssigneeMinnesota Mining and Manufacturing Company
InventorsRichard E. Bennett, Gerald C. Bird, Mark K. Nestegard, Eleanor Rudin
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Abstract
A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.
Claims37
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 3.times.10.sup.5 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive comprises a hydrogenated thermoplastic elastomer block copolymer, and an adhesion modifier selected from the group consisting of tackifying resin, liquid rubber, and a photocrosslinking agent, wherein the adhesive has a storage modulus at room temperature greater than 3.times.10.sup.5 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive comprises a thermoplastic elastomer block copolymer and a photocrosslinking agent, wherein the adhesive has a storage modulus at room temperature greater than 3.times.10.sup.5 Pascals, and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive on a permanent backing, wherein the adhesive comprises a hydrogenated thermoplastic elastomer block copolymer that displays a storage modulus at 20 C. of 2.7.times.10.sup.6 Pascals to 4.0.times.10.sup.6 Pascals and wherein the tape attaches to a surface of a semiconductor wafer under ambient conditions.
A semiconductor wafer processing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 1.times.10.sup.6 Pascals and comprises a thermoplastic elastomer block copolymer, and further wherein the tape exhibits a peel adhesion of about 20 to 500 grams per linear inch width to a substrate selected from the group consisting of silicon, polyimide, silicon oxynitride passivation layer, and photoresist coatings both at the time of applying the tape to the substrate and after dwelling in contact with the substrate for at least 7 days under ambient conditions.
A semiconductor wafer dicing tape comprising a permanent backing and a layer of a non-pressure sensitive adhesive on the permanent backing, wherein the adhesive has a storage modulus at room temperature greater than 1.times.10.sup.6 Pascals and comprises a thermoplastic elastomer block copolymer, and further wherein the tape exhibits a peel adhesion of about 20 to 200 grams per linear inch width to the silicon surface of a semiconductor wafer both at the time of applying the tape and after dwelling in contact with the substrate for at least 7 days under ambient conditions.
Dependencies are inferred from the claim text.