Prepreg, process for producing the same and printed circuit substrate/board using the same
AssigneeSumitomo Chemical Company, Limited
InventorsTsutomu Takahashi, Yoshifumi Tsujimoto, Hiroaki Kumada, Hiroyuki Sato
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Abstract
The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.
Claims5
A prepreg comprising a porous para-oriented aromatic polyamide film impregnated with a thermoplastic resin and/or a thermosetting resin, wherein the porous para-oriented aromatic polyamide film is composed of para-aramid fibrils having a diameter of not more than 1 .mu.m, with the fibrils planarly arranged as a network or a nonwoven fabric and laminated in layer form, and the film has a linear thermal expansion coefficient at 200.degree. to 300.degree. C. of .+-.50.times.10.sup.-6 /.degree.C. and has 30 to 95% of vacant spaces.
Dependencies are inferred from the claim text.