Polymerizable flux composition for encapsulating the solder in situ

A polymerizable composition comprising:

• an epoxy-based flux formulation including, by weight, between 55%-65% of an epoxide composition;
• between 0% and 15% of a dicarboxylic acid;
• between 9% and 11% of a polyfunctional alcohol;
• between 3% and 5% of a curing agent;
• and
• dispersed metal particles which melt at a temperature not exceeding 200.degree. C. for fusing at such a temperature to form electrically-conductive continuous metal encapsulated within cured polymerized composition, wherein the metal particles form between 80% and 95% by weight of the polymerizable composition.

A process of forming an encapsulated metallurgical joint from a polymerizable flux composition including dicarboxylic acid flux and particles dispersed therein of a metal which melts at a temperature not exceeding 200.degree. C., the process comprising the steps of:

• placing the polymerizable composition on the surface of a substrate;
• heating the composition to a temperature not exceeding 200.degree. C. for a time interval sufficient to melt the metal particles and remove surface oxide layer therefrom by the fluxing actin of the dicarboxylic acid to form continuous fused molten metal;
• heating the composition to a temperature not exceeding 200.degree. C. for an additional time interval to segregate the polymerizable flux composition from the fused metal, and to cure the polymerizable flux composition for creating a continuous polymerized thermoset surface layer encapsulating the fused molten metal;
• and
• cooling the composition to allow the fused molten metal to solidify as continuous metal encapsulated within the cured polymerized flux composition.