Method of manufacturing and assembling an integrated circuit card

A method of manufacturing and assembling an electronic card comprising an electrically insulating card support provided with a cavity having a bottom and at least first and second opposing side walls, the cavity being provided in the card support for accommodating an integrated circuit defining first and second opposed sides, said integrated circuit having a first group of contacts which are provided on said first side and a second group of contacts which are provided on said first side and, said electrically insulating card support having on one surface metal contact pads electrically connected to respective contacts of said integrated circuit, said metal contact pads being respectively arranged in first and second groups adjacent the first and second side walls of said cavity, the method comprising the following steps:

• a first step comprises providing electrical conductor tracks on the card support, each of said tracks being positioned against the bottom and a sidewall of said cavity and each of said tracks connected to one of said metal contact pads arranged on the surface of the support, the conductor tracks being provided so that each traverses the bottom of the cavity from one of said first and second side walls towards the other of said first and second side walls by more than half the dimension of the cavity defined by the first and second side walls, wherein said tracks connected to said first group of metal contacts pads alternate with said tracks connected to said second group of metal contact pads,
• a second step comprises gluing said second side of said integrated circuit, to the bottom of the cavity, wherein said first group of contacts on said integrated circuit are positioned adjacent said first group of metal contact pads and said second group of contacts on said integrated circuit are positioned adjacent said second group of metal contact pads, the integrated circuit being glued by means of non-conducting glue on a number of said tracks,
• a third step comprises soldering conductor wires between the contacts of the integrated circuit and ends of corresponding conductor tracks, the ends of said tracks connected to said first group of metal contact pads being connected to said second group of contacts on said integrated circuit and ends of said tracks connected to said second group of metal contact pads being connected to said first group of contacts of said integrated circuit, and
• a fourth step comprises filling the cavity with a protective resin which is subsequently polymerised.