Method of mounting a piezoelectric element
AssigneeMurata Mfg. Co., Ltd.
InventorMorimoto Ryoichi
Life of this patent
Estimating the term…
Abstract
An opening is formed in a region of a circuit board opposite a vibration region E of a piezoelectric element. The piezoelectric element is mounted to the circuit board, and electrical connections extend between and support the piezoelectric element from the circuit board by a solder. The soldered connection portions are surrounded by a bonding agent. An opening in the circuit board prevents any excess bonding agent from invading the vibration region E of the piezoelectric element, and the bonding agent assists in dispersing stresses exerted on the circuit board thereby minimizing the stresses transferred to the piezoelectric element.
Claims16
A method of mounting a piezoelectric element to a circuit board, the piezoelectric element having a vibration region, the method comprising the steps of:
- positioning the piezoelectric element relative to the circuit board;
- soldering the piezoelectric element to the circuit board to form a soldered electrical connection;
- applying a bonding agent around at least a portion of the soldered electrical connection;
- and
- drawing excess bonding agent away from the vibration region of the piezoelectric element through at least one hole in the circuit board.
A method of mounting a piezoelectric element to a circuit board, the piezoelectric element having a vibration region between connecting electrodes at opposite longitudinal ends of the piezoelectric element and the circuit board having solder connection portion regions for electrically connecting the piezoelectric element to the circuit board;
- the method comprising the steps of:
- forming an opening in the circuit board opposite the vibration region of the piezoelectric elements;
- positioning the piezoelectric element relative to the circuit board;
- soldering the piezoelectric element to the circuit board to form a soldered electrical connection;
- and
- applying a bonding agent around at least a portion of the soldered electrical connection segregated from the vibration region of the piezoelectric element to disperse stress communicated by the circuit board to the piezoelectric element through the soldered electrical connection, the opening in the circuit board preventing the bonding agent from invading and adhering to the vibration region.
A method of mounting a piezoelectric element to a circuit board, the piezoelectric element having a vibration region between connecting electrodes at opposite longitudinal ends of the piezoelectric element and the circuit board having solder connection portion regions for electrically connecting the piezoelectric element to the circuit board;
- the method comprising the steps of:
- positioning the piezoelectric element relative to the circuit board;
- soldering the piezoelectric element to the circuit board to form a soldered electrical connection;
- and
- applying a bonding agent around at least a portion of the soldered electrical connection segregated from the vibration region of the piezoelectric element to disperse stress communicated by the circuit board to the piezoelectric element through the soldered electrical connection;
- and
- discharging bonding agent away from the vibration region through a hole in the circuit board opposite the vibration region of the piezoelectric element.
A method of mounting a piezoelectric element to a circuit board, the piezoelectric element having a vibration region between connecting electrodes at opposite longitudinal ends of the piezoelectric element and the circuit board having solder connection portion regions for electrically connecting the piezoelectric element to the circuit board;
- the method comprising the steps of:
- positioning the piezoelectric element relative to the circuit board;
- soldering the piezoelectric element to the circuit board to form a soldered electrical connection;
- and
- applying a bonding agent around at least a portion of the soldered electrical connection segregated from the vibration region of the piezoelectric element to disperse stress communicated by the circuit board to the piezoelectric element through the soldered electrical connection;
- and
- forming slots in the circuit board at a boundary between the vibration region of the piezoelectric element and the solder connection portions of the circuit board to prevent the bonding agent from invading the vibration region of the piezoelectric element.
A method of mounting a piezoelectric element having a vibration region to a circuit board and of dispersing stress from the circuit board, the circuit board having means for preventing invasion of a bonding agent into the vibration region of the piezoelectric element, the method comprising the steps of:
- positioning the piezoelectric element relative to the circuit board;
- soldering the piezoelectric element to the circuit board to form a soldered electrical connection and to thereby mount the piezoelectric element to the circuit board;
- applying bonding agent to the mounted piezoelectric element around at least a portion of the soldered electrical connection;
- and
- drawing excess bonding agent away from the vibration region of the piezoelectric element through the invasion preventing means on the circuit board.
Dependencies are inferred from the claim text.