Simulation apparatus for optimizing sputtering apparatus and simulation method therefor

A simulation method for simulating and optimizing a configuration of a sputtering apparatus by obtaining a distribution of angles of target atoms ejected from a target of the sputtering apparatus by using a computer, comprising the steps of:

• a first step of calculating a temperature of the surface of said target in consideration of cooling of said target;
• a second step of calculating an initial velocity of atoms within said target based on said calculated target surface temperature;
• a third step of calculating an incidence rate of incident ions into said target to determine a position at which the incident ions collide against the target;
• a fourth step of obtaining trajectories of atoms within said target based on the calculation results of said first, said second, and said third steps;
• and
• a fifth step of extracting sputtered atoms based on the calculation results of said fourth step to obtain an ejection angle distribution;
• and a sixth step of outputting siad ejection angle distribution.

A computer program product for enable a simulation apparatus to simulate and optimize a configuration of a sputtering apparatus by obtaining a distribution of angles of target atoms ejected from a target of the sputtering apparatus by using a computer, comprising:

• software instructions, and
• a computer readable medium including said software instructions;
• wherein said software instructions enable said simulation apparatus to perform the steps of:
• calculating a temperature of the surface of said target in consideration of cooling of said target;
• calculating an initial velocity of atoms within said target based on said calculated target surface temperature;
• calculating an incidence rate of incident ions into said target to determine a position at which the incident ions collide against the target;
• obtaining trajectories of atoms within said target based on the calculation results of each of said means;
• and
• extracting sputtered atoms based on the calculation results of said atom trajectory calculating means to obtain ejection angle distribution.