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US 5,850,104 AGranted
Integral lid/clamp for high power transistor
AssigneeSpectrian Corporation
InventorSteven E. Avis
Life of this patent
Estimating the term…
Abstract
An integral semiconductor package and mounting structure in which a lid for sealing a semiconductor chip on a platform includes flanges extending beyond the platform with the flanges having holes for receiving screws for mounting the package to a heat sink. The flanges are flexed into engagement with a heat sink thereby maintaining the package in yieldable pressure engagement with the heat sink.
Claims11
A power semiconductor device package comprising
- a semiconductor chip in which a semiconductor device is formed,
- a platform on which said semiconductor chip is mounted,
- a plurality of leads electrically contacting said chip and extending from said platform, and
- a lid for engaging said platform and sealing said chip, said lid having a plurality of flanges extending beyond said platform and having holes for receiving fasteners for use in mounting the package to a heat sink.
1 more element
Dependencies are inferred from the claim text.