Production method for photo-sensitive resin and liquid photo-sensitive resin composition

Abstract

The present invention provides a production method for a photo-sensitive resin, characterized in reacting a difunctional epoxy resin (B) having two epoxy groups in a molecule with carboxyl groups contained in a resin (A) having two or more (meth)acryloyl groups and at least one carboxyl group in a molecule. Since the photo-sensitive resin prepared by extending the resin (A) to a high molecular weight linearly via the difunctional epoxy resin (B) is obtained, a resist layer having an excellent tack-free property can be formed. Further, a resist layer irradiated with rays through a patterning film can be developed rapidly and correctly in an alkaline aqueous solution. Accordingly, it has been possible to provide the high-performance liquid photo-sensitive resin compositions useful for a solder resist used for producing printed circuit boards and for an electroless plating resist or useful for producing black matrices and color filters for liquid crystal displays. Further, the coated layer formed by photo-curing the liquid photo-sensitive resin composition containing the polymer fine particles having a Tg of 20.degree. C. or lower has an advantage that the coated layer provides an excellent adhesion even if it is exposed to a heating process.

Dependencies are inferred from the claim text.