Semiconductor package and a method of manufacturing thereof

A method of manufacturing a semiconductor package, comprising the steps of:

• a) attaching a semiconductor chip having a plurality of contact pads to a substrate having a plurality of conductive patterns;
• b) electrically connecting the contact pads with upper surfaces of the conductive patterns;
• c) molding the semiconductor chip and the upper surfaces of the conductive patterns;
• d) forming a plurality of holes in an insulating film, wherein said holes have walls;
• e) forming a plurality of protruding portions at said walls formed in said insulating film;
• f) forming a conductive media in the holes to extend above the insulating film;
• g) aligning lower surfaces of the conductive media with a corresponding plurality of pads formed on a printed circuit board;
• h) aligning lower surfaces of the conductive patterns of the substrate with upper surfaces of the conductive media;
• and
• i) electrically connecting the contact pads, the conductive media and the pads on the printed circuit board.

A method of manufacturing a semiconductor package comprising the steps of:

• a) attaching leads to a semiconductor chip;
• b) electrically connecting bonding pads of the semiconductor chip to corresponding ones of the leads;
• c) packaging the semiconductor chip and the leads with a resin such that at least a portion of each of the leads is exposed;
• d) forming a plurality of holes in an insulating film, wherein said holes have walls;
• e) forming a plurality of protruding portions at said walls formed in said insulating film;
• f) forming conductive media in the holes to extend above the insulating film;
• g) aligning exposed portions of the leads with upper surfaces of corresponding ones of the conductive media;
• h) aligning lower surfaces of the conductive media with a corresponding plurality of pads formed on a printed circuit board;
• and
• i) electrically connecting the leads, the conductive media and the pads of the printed circuit board.