Photosensitive resin composition and method for using the same in manufacture of circuit boards

A photosensitive resin composition, comprising:

• a first reaction product that is a reaction product of (A) a member of the group consisting of a bisphenol A epoxy resin, a phenol novolak epoxy resin, and a cresol novolak epoxy resin, and an epoxy resin halide thereof with (B) an unsaturated carboxylic acid in an acid equivalent/epoxy equivalent ratio within the range of 0.1 to 1.0, wherein hydroxyl groups of said reaction product are reacted with a saturated or unsaturated polybasic acid anhydride in an acid equivalent/hydroxyl equivalent ratio within the range of 0.1 to 1.0;
• (b) a thermosettable epoxy resin;
• (c) a second reaction product that is a reaction product of an epoxy resin and a carboxy terminated acrylonitrile-butadiene rubber;
• (d) a photo-polymerization initiator;
• and
• (e) a thermosetting agent.

A photosensitive resin composition, comprising:

• (a) 10 to 80 parts by weight of a first reaction product that is a reaction product of (A) a member of the group consisting of a bisphenol A epoxy resin, a phenol novolak epoxy resin, and a cresol novolak epoxy resin, and an epoxy resin halide thereof with (B) an unsaturated carboxylic acid;
• (b) 10 to 80 parts by weight of a thermosettable epoxy resin;
• (c) 10 to 80 parts by weight of a second reaction product that is a reaction product of an epoxy resin and a carboxy terminated acrylonitrile-butadiene rubber;
• (d) 0.1 to 10 parts by weight of a photo-polymerization initiator;
• and
• (e) 0.1 to 20 parts by weight of a thermosetting agent,
• wherein the total weight of the photosensitive resin composition comprises 100 parts by weight.

A photosensitive resin composition, comprising:

• (a) 10 to 50 parts by weight of a first reaction product that is a reaction product of (A) a member of the group consisting of a bisphenol A epoxy resin, a phenol novolak epoxy resin, and a cresol novolak epoxy resin, and an epoxy resin halide thereof with (B) an unsaturated carboxylic acid;
• (b) 10 to 50 parts by weight of a thermosettable epoxy resin;
• (c) 10 to 50 parts by weight of a second reaction product that is a reaction product of an epoxy resin and a carboxy terminated acrylonitrile-butadiene rubber;
• (d) 0.1 to 10 parts by weight of a photo-polymerization initiator;
• and
• (e) 0.1 to 20 parts by weight of a thermosetting agent, wherein hydroxyl groups of said first reaction product have been reacted with an unsaturated polybasic acid anhydride;
• and
• wherein the total weight of the photosensitive resin composition comprises 100 parts by weight.