Method of sticking semiconductor wafer and its sticking device
AssigneeKomatsu Electronic Metals Co., Ltd.
InventorsKiyoharu Miyakawa, Osamu Morikawa
Life of this patent
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Abstract
A method of sticking a semiconductor wafer and its sticking equipment. The semiconductor wafer can be flat and efficiently stuck on a plate. The semiconductor wafer, which has its inner surface coated with an adhesive, is tiltedly configured to permit raising a circumference to a height of Ah and located the wafer above a sticking position on the plate. The semiconductor wafer is pressed by a lower end of a stamp-press to be parallel to a surface of the plate. Then a vacuum chuck (2) stops sucking to release the semiconductor wafer from a transporting arm, and the transporting arm is moved away. The stamp-press is moved downward to press a whole surface of the semiconductor wafer.
Claims9
A method of sticking a semiconductor wafer onto a plate, including transporting the semiconductor wafer to a position above a sticking position on the plate by a transporting arm used to hold the semiconductor wafer by vacuum action, and sticking the semiconductor wafer to the plate by pressing the semiconductor wafer by a stamp-press, wherein:
- during the transporting, the transporting arm is tilted so that a front end of the semiconductor wafer is maintained at a fixed distance higher than a rear end of the semiconductor wafer while the semiconductor wafer is transported to a position above the sticking position on the plate, and
- during the sticking of the semiconductor wafer to the plate, the semiconductor wafer is released by the transporting arm while the semiconductor wafer is held substantially parallel to a surface of the plate by pressing of the stamp-press, the transporting arm is moved away from the plate, and the semiconductor wafer is then pressed against the plate by the stamp-press.
A method of sticking a semiconductor wafer onto a plate, including transporting the semiconductor wafer to a position above a sticking position on the plate by a transporting arm used to hold the semiconductor wafer by vacuum action, and sticking the semiconductor wafer to the plate by pressing the semiconductor wafer by a stamp-press, wherein:
- during the transporting, the transporting arm is tilted so that a front end of the semiconductor wafer is maintained a fixed distance higher than a rear end of the semiconductor wafer while the semiconductor wafer is transported to a position above the sticking position on the plate, and
- during the sticking of the semiconductor wafer to the plate, the semiconductor wafer is held by the transporting arm while pressed by the stamp-press, the semiconductor wafer contacts a surface of the plate by pressing of the stamp-press, the transporting arm is moved away from the plate, and the semiconductor wafer is pressed against the plate by the stamp-press.
A method of sticking a semiconductor wafer onto a plate, including transporting the semiconductor wafer to a position above a sticking position on the plate by a transporting arm used to hold the semiconductor wafer by vacuum action, and sticking the semiconductor wafer to the plate by pressing the semiconductor wafer by a stamp-press, wherein:
- during the transporting, the transporting arm is tilted so that a front end of the semiconductor wafer is maintained a fixed distance higher than a rear end of the semiconductor wafer while the semiconductor wafer is transported to a position above the sticking position on the plate, and
- during the sticking of the semiconductor wafer to the plate, the semiconductor wafer is held by the transporting arm while pressed by the stamp-press, the transporting arm and the stamp-press are moved so that the semiconductor wafer contacts a surface of the plate by pressing of the stamp-press, and the transporting arm is moved away from the plate, and the semiconductor wafer is pressed against the plate by the stamp-press.
Dependencies are inferred from the claim text.