Ball contact for flip-chip devices
AssigneeTexas Instruments Incorporated
InventorAnthony M. Chiu
Life of this patent
Estimating the term…
Abstract
A contact for a semiconductor device or passive substrate is made up of an array of conductive balls, the individual balls of the contact being a compressible material coated with a metal conductive material. The balls in the array are compressed while being bonded to the contact area to provide a larger bond area between the ball and the contact area to which it is bonded.
Claims11
A method for making a contact for a semiconductor device, comprising the steps of:
- arranging a plurality of ball contact elements in an n.times.n array where n is an integer greater than 1;
- temporarily mounting the n.times.n array of ball contact elements on a contact area on the semiconductor device;
- and
- bonding the n.times.n array of ball contact elements to the contact area on the semiconductor device.
A method for making a contact on a contact area on a semiconductor device, comprising the steps of:
- arranging a plurality of ball contact elements in an n.times.n array where n is an integer greater than 1;
- applying an adhesive to the contact area on the semiconductor device;
- temporarily mounting the n.times.n array of ball contact elements with said adhesive on the contact area on the semiconductor device;
- and
- bonding the n.times.n array of ball contact elements to the contact area on the semiconductor device.
A method for making a contact on a contact area on a semiconductor device, comprising the steps of:
- arranging a plurality of ball contact elements in an n.times.n array where n is an integer greater than 1;
- applying an adhesive to the contact area on the semiconductor device;
- temporarily mounting the n.times.n array of ball contact elements with said adhesive on the contact area on the semiconductor device such that said ball contact elements are in contact with the contact area on the semiconductor device;
- applying pressure to said ball contact elements to compress the ball elements, increasing the area of contact of the ball contact elements with the semiconductor device contact area;
- and
- bonding the n.times.n array of ball contact elements to the contact area on the semiconductor device.
Dependencies are inferred from the claim text.