Megasonic cleaning methods and apparatus

Abstract

A cleaning method for use in fabrication of integrated circuit devices includes providing a surface of a substrate assembly. The surface is exposed to a cleaning solution having megasonic energy projected therethrough. Gas bubbles are passed across the surface. A gas flow is introduced into the cleaning solution at a position relative to the surface such that the bubbles formed pass across the surface of the substrate assembly as the bubbles rise in the solution. Further, the pH of the cleaning solution may be controlled by the introduction of the gas bubbles in the cleaning solution. A megasonic cleaning apparatus for carrying out the method is also provided which includes a tank for holding the cleaning solution into which the surface is immersed. A megasonic transducer projects megasonic energy therethrough and a gas feed device provides a gas flow to a position relative to the surface immersed in the tank such that gas bubbles formed in the cleaning solution pass across the surface as the gas bubbles rise in the cleaning solution.

Dependencies are inferred from the claim text.