Load regulating expansion fixture
AssigneeThe Regents of the University of California
InventorsLawrence M. Wagner, Michael J. Strum
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Abstract
A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components.
Claims19
A free standing, differential expansion fixture for solid state bonding, comprising:
- a table;
- a lower anvil assembly mounted on said table;
- an upper anvil;
- and
- means for removably retaining said upper anvil in alignment with said lower anvil assembly;
- said lower anvil assembly being provided with plurality of a load regulators.
A device for solid-state bonding of thin foils or films including a platen and a lower anvil, the improvement comprising:
- a plurality of load regulators located intermediate said platen and lower anvil of said device.
Dependencies are inferred from the claim text.