Method for fabrication of probe
AssigneeNitto Denko Corporation
InventorsAtsushi Hino, Shoji Morita, Masakazu Sugimoto
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Abstract
A method for fabrication of a probe includes the steps of: (1) forming a structure wherein a contact part formed on one side of an insulating flexible substrate and a conductor formed on either side or the inside of the flexible substrate are electrically continued, and (2) joining the flexible substrate and a rigid frame substrate capable of supporting the tension in the planar direction of the flexible substrate at the outer periphery thereof, by bonding them by lamination pressing after heating, or by heating after lamination pressing, thereby applying a planar tension to the flexible substrate enclosed by the rigid substrate.
Claims8
A method for fabrication of a probe, comprising the steps of:
- (a) forming a conductive layer on one side of an insulating flexible substrate;
- (b) bonding said flexible substrate to a rigid frame substrate capable of supporting, at the outer periphery thereof, a tension in the plane of said flexible substrate;
- (c) heating the flexible substrate to generate, in the flexible substrate, a residual stress toward shrinkage;
- and
- (d) then processing the conductive layer into a circuit pattern, thus removing portions of said conductive layer and eliminating an obstacle to shrinkage, thereby applying a planar tension to the flexible substrate.
Dependencies are inferred from the claim text.