Method for mounting an electronic component on a wiring substrate and an illuminating switch unit using this mounting method

A method for mounting an electronic component on a wiring substrate, comprising:

• forcibly inserting a main body of an electronic component into an opening of an insulating film, said electronic component having terminals extending from a surface thereof, said insulating film being made of a resilient material, said opening having a size substantially equivalent to or slightly smaller than an outer configuration of said main body of said electronic component to obtain a press fit between said main body of said electronic component and said insulating film;
• placing said electronic component held by said insulating film on an insulating substrate, and bringing said terminals of said electronic component into contact with a conductive pattern formed on said insulating substrate;
• and
• connecting said insulating film and said insulating substrate by locally fusing a region surrounding said terminals of said electronic component, thereby mounting said electronic component on said insulating substrate.