Optically-guiding multichip module
AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorsFranz Haas, Paul R. Cook
Life of this patent
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Abstract
A Fiber Optic Plate is the substrate or part of the substrate in a multichip module. Multichip modules can be stacked to form layers of densely packed integrated circuit die. Optical signals carry data from one layer in the stack to one or more of the other multichip module layers or to peripheral devices physically separate from the stack. Data are transmitted at much greater speed by such optical signals than by traditional electronic interconnects. The Fiber Optic Plate guides the optical signals, minimizing signal crosstalk and allowing for many optical signals to occupy a small area on the module. A Fiber Optic Plate as all or part of the multichip module also provides a means to accurately align the individual modules in a stack.
Claims17
An optical interconnect apparatus, which comprises:
- at least one fiber optic plate incorporated into a first multichip module;
- said first multichip module being disposed so that an optical signal passes through said fiber optic plate, from an optical emitter disposed upon a second multichip module, to an optical detector disposed upon said first multichip module;
- and
- said optical emitter and said optical detector being aligned so that said optical signal passes between them with substantially no loss.
A method of transmitting an optical signal between at least two multichip modules, said method comprising the steps of:
- incorporating at least one fiber optic plate into at least one of said at least two multichip modules;
- placing at least one optical emitter and at least one optical detector upon each of said at least two multichip modules;
- and
- aligning said at least one optical emitter with said at least one optical detector, whereby said optical signal is transmitted with substantially no loss between said at least two multichip modules.
Apparatus for transmitting an optical signal between at least two multichip modules, which comprises:
- means for incorporating at least one fiber optic plate into at least one of said at least two multichip modules;
- means for placing at least one optical emitter and at least one optical detector upon each of said fiber optic plates;
- and
- means for aligning said at least one optical emitter on a first of said at least two multichip modules with said at least one optical detector on a second of said at least two multichip modules, whereby said optical signal is transmitted with substantially no loss between said at least two multichip modules.
Apparatus for aligning at least one multichip module, which comprises:
- an external light source;
- a fiber optic plate incorporated into each of said at least one multichip module;
- said fiber optic plate having an aperture;
- and
- said external light source being disposed so that, when said at least one multichip module is aligned, the amount of light emitted from said external light source that passes through said aperture is maximized.
Apparatus for aligning at least one multichip module, which comprises:
- an external light source;
- a fiber optic plate incorporated into said at least one multichip module;
- at least one position-sensing optical detector placed on said fiber optic plate;
- and
- said external light source and said at least one position-sensing optical detector being disposed so that, said at least one position-sensing optical detector emits an electrical signal that indicates when said at least one multichip module is aligned with said external light source.
Dependencies are inferred from the claim text.