Expansion-matched high-thermal-conductivity stress-relieved mounting modules

An optical communication system comprising:

• a) a heat-dissipating light source;
• b) a high-thermal-conductivity stress-relieved mounting module comprising:
• a thermally conductive mounting plate having a mounting surface for mounting said heat-dissipating light source, and
• a heat transfer surface opposite said mounting surface;
• and
• a thermally conductive, stress-relieved bulk layer attached to said heat transfer surface, wherein said bulk layer has a set of stress-relief apertures {A›j!} for accommodating an expansion of said bulk layer along said heat transfer surface, j=1 . . . J, J>1;
• and
• c) a modulator optically coupled to said light source, for encoding a datum in an output of said light source.

A printing system comprising:

• a) a heat-dissipating light source having an output for printing;
• b) a high-thermal-conductivity stress-relieved mounting module comprising:
• a thermally conductive mounting plate having
• a mounting surface for mounting said heat-dissipating light source, and
• a heat transfer surface opposite said mounting surface;
• and
• a thermally conductive, stress-relieved bulk layer attached to said heat transfer surface, wherein said bulk layer has a set of stress-relief apertures {A›j!} for accommodating an expansion of said bulk layer along said heat transfer surface, j=1 . . . J, J>1;
• and
• c) an imaging system in optical communication with said light source to receive the output from said light source for input to said imaging system, said imaging system providing for printing of said output.

A stress-relieved thermal conduction device comprising:

• a) a first piece having a first thermal expansion coefficient;
• and
• b) a second piece bonded to said first piece along a contact surface, wherein
• said second piece has a second thermal expansion coefficient different from said first thermal expansion coefficient,
• said second piece has a stress-relief aperture adjacent to said contact surface, for accommodating an expansion of said second piece along said contact surface.

A method of cooling a heat-dissipating element, said method comprising the step of establishing a thermal communication between said element and a heat sink, through a high-thermal-conductivity stress-relieved mounting module, said module comprising

• a thermally conductive mounting plate having
• a mounting surface for mounting a heat-dissipating element, and
• a heat transfer surface opposite said mounting surface;
• and
• a thermally conductive, stress-relieved bulk layer attached to said heat transfer surface, wherein said bulk layer has a set of stress-relief apertures {A›j!} for accommodating an expansion of said bulk layer along said heat transfer surface, j=1 . . . J, J>1.