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US 5,847,985 AGranted
Memory modules
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHidenori Mitani, Masanori Nagahama
Life of this patent
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Abstract
A memory module comprising a plurality of identical wiring boards stacked in a multi-stage fashion provides with only one decoder mounted on one of the plurality of identical wiring boards and a plurality of inter-pattern connection means arranged on the wiring boards each for selectively connecting a first wiring pattern connected to said output of said decoder and a second wiring pattern connected to said at least one IC memory chip on each wiring board.
Claims7
A memory module comprising:
- a plurality of identical wiring boards each having a wiring pattern formed thereon and at least one IC memory chip mounted thereon;
- board connection means which supports said plurality of wiring boards in a multi-stage fashion and electrically connects respective wiring boards;
- one decoder mounted on one of said plurality of wiring boards which decoded address signals externally input and outputs control signals;
- each of said wiring patterns comprising a first wiring pattern being connected to the output of said decoder and a second wiring pattern being connected to said at least one IC chip mounted on said each wiring board;
- and
- inter-pattern connection means arranged on each wiring board for selectively connecting said first wiring pattern and said second wiring pattern.
3 more elements
Dependencies are inferred from the claim text.