US 5,847,960 A · Multi-tool positioning system

Abstract

A multi-rate, multi-head positioner (150) receives and processes unpanelized positioning commands to actuate slow stages (56, 58) and multiple fast stages (154) that are mounted on one of the slow stages to simultaneously position multiple tools (156) relative to target locations (162) on multiple associated workpieces (152). Each of the fast stages is coupled to a fast stage signal processor (172) that provides corrected position data to each fast stage positioner to compensate for fast stage nonlinearities and workpiece placement, offset, rotation, and dimensional variations among the multiple workpieces. When cutting blind via holes in etched circuit boards (ECBs), improved throughput and process yield are achieved by making half of the tools ultraviolet ("UV") lasers, which readily cut conductor and dielectric layers, and making the other half of the tools are infrared ("IR") lasers, which readily cut only dielectric layers. The UV lasers are controlled to cut an upper conductor layer and a portion of an underlying dielectric layer, and the IR lasers are controlled to cut the remaining dielectric layer without cutting through or damaging a second underlying conductor layer. The throughput is increased by cutting conductor layers in unprocessed ECBs while concurrently cutting dielectric layers in ECBs that have already had their conductor layer cut. The process yield is increased by performing a workpiece calibration prior to each cutting step to account for any ECB placement, offset, rotation, and dimensional variations.

Claims34

Dependent claims

In a tool positioning system that is implemented as part of a workpiece processing system in which the workpieces are electronic devices or electronic device packages, the tool positioning system simultaneously positioning multiple tools relative to a set of target locations on multiple associated workpieces in response to a set of positioning commands, comprising:

a slow positioner stage effecting a large range of relative movement between the multiple tools and the multiple associated workpieces;
multiple fast positioner stages coupled to the slow positioner stage effecting small ranges of relative movement between the multiple tools and the multiple associated workpieces;
a positioning signal processor deriving from the set of positioning commands slow and fast movement-controlling signals;
a slow positioner driver controlling the large range of relative movement of the slow positioner stage in response to the slow movement-controlling signal;
and
multiple fast positioner drivers controlling the small ranges of relative movements of the associated fast positioner stages in response to the fast movement-controlling signal.

3 more elements

In a tool positioning system that is implemented as part of a workpiece processing system in which the workpieces are electronic devices or electronic device packages, the tool positioning system carrying out a method for simultaneously positioning multiple tools relative to a set of target locations on multiple associated workpieces in response to a set of positioning commands, comprising:

providing a slow positioner stage for effecting a large range of relative movement between the multiple tools and the multiple associated workpieces;
mounting the multiple workpieces to the slow positioner stage;
providing multiple fast positioner stages for effecting small ranges of relative movement between the multiple tools and the multiple associated workpieces;
processing the set of positioning commands to generate slow and fast movement-controlling signals;
driving the slow positioner stage within the large range of relative movement in response to the slow movement-controlling signal;
driving the multiple fast positioner stages within the small ranges of relative movements in response to the fast movement-controlling signal;
and
coordinating the large and small ranges of relative movement such that the multiple tools are rendered temporarily stationary relative to the multiple workpieces during predetermined time periods when the slow and fast positioner stages are moving.

5 more elements

In a tool positioning system that is implemented as part of a workpiece processing system in which the workpieces are electronic circuit boards, the tool positioning system carrying out a method for cutting a predetermined hole pattern in at least first and second substantially identical circuit boards each having at least a first conductor layer, a dielectric layer, and a second conductor layer, comprising:

generating at least first and second laser beams having respective first and second wavelengths;
mounting the circuit boards on a slow positioner stage that effects a large range of relative movement between the laser beams and the circuit boards;
providing at least first and second fast positioner stages that are coupled to the slow positioner stage to effect small ranges of relative movement between the laser beams and associated ones of the circuit boards;
and
coordinating the large and small ranges of relative movement such that the first laser beam cuts the predetermined hole pattern in the first conductor layer of the first circuit board while the second laser beam cuts the predetermined hole pattern in the dielectric layer of the second circuit board.

2 more elements

In a tool positioning system that is implemented as part of a workpiece processing system in which the workpieces are electronic circuit boards, the tool positioning system carrying out a method for cutting a predetermined hole pattern in a set of substantially identical circuit boards each having at least a first conductor layer, a dielectric layer, and a second conductor layer, comprising:

generating a first set of laser beams suitable for cutting the first conductor layer and a second set of laser beams suitable for cutting the dielectric layer;
mounting first and second subsets of the circuit boards on a slow positioner stage that effects a large range of relative movement between the laser beams and the circuit boards;
providing at least first and second fast positioner stages that are coupled to the slow positioner stage to effect small ranges of relative movement between the laser beams and associated ones of the circuit boards;
and
coordinating the large and small ranges of relative movement such that the first set of laser beams cut the predetermined hole pattern in the first conductor layers of the first subset of the circuit boards while the second set of laser beams concurrently cut the predetermined hole pattern in the dielectric layers of the second subset of the circuit boards.

2 more elements

Dependencies are inferred from the claim text.

Multi-tool positioning system

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Multi-tool positioning system

Life of this patent

Abstract

Claims34