Method and apparatus for run-time correction of proximity effects in pattern generation
AssigneeEtec Systems, Inc.
InventorsLee H. Veneklasen, Robert Innes, Sergey Babin, David Trost, Jeffrey Varner
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AssigneeEtec Systems, Inc.
InventorsLee H. Veneklasen, Robert Innes, Sergey Babin, David Trost, Jeffrey Varner
Estimating the term…
An electron beam pattern generating system for exposing a pattern on a substrate using a raster scan method. The system stores a rasterized representation of the pattern as a plurality of regular pixel dose exposure levels. These pixel dose exposure levels are evaluated by the system for one or more proximity effects and corrections to the dose exposure level and/or pixel location are calculated. The system includes apparatus for both calculation and storage of intermediate and final results as required. As they are calculated, the corrections are provided to an exposure dose modulator wherein they are applied to forming the pattern. Thus corrections for both long range and short range proximity effects due to both electron scattering and heating as well as for proximity effects due to global thermal expansion can be calculated and provided during run-time and a corrected pattern exposed.
A method of forming a pattern using a pattern generation lithography system having a beam, comprising converting a first data base having a vectorized representation of said pattern into a second data base having a rasterized representation of said pattern as pixels, wherein each pixel of said rasterized representation has a first exposure dose, and one or more steps selected from the group consisting of:
A method of forming a pattern using a beam corrected for proximity effects comprising the steps of:
A pattern generating system comprising:
Dependencies are inferred from the claim text.