Hybrid integrated circuit
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYukio Yasuda
Life of this patent
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Abstract
A hybrid integrated circuit comprises a circuit substrate including an insulation substrate with various devices mounted thereon and with a patterned wiring having at least one selected electrode formed along one side of the insulation substrate and a metal conductor member including a plate portion with a pair of L-shaped clips, formed along one side thereof corresponding to the one side of the circuit substrate, for holding the circuit substrate inserted into the clips which are formed at places corresponding to the selected electrode of the circuit substrate so that the clips and the selected electrode make electrical contact when the circuit substrate is inserted into the clips.
Claims14
A hybrid integrated circuit comprising:
- a circuit substrate including an insulation substrate with at least one electronic device mounted thereon and with a patterned wiring having plural electrodes formed along one side of said insulation substrate;
- and
- a metal conductor member including a plate portion with at least one L-shaped clip member, formed along a side thereof corresponding to said one side of said circuit substrate for holding said circuit substrate inserted into said clip means, said insulation substrate being adhered to said metal conductor member over substantially an entire surface area of the plate portion by an insulate adhesive,
- said at least one clip member being formed on said metal conductor member to correspond to at least one of said plural electrodes of said circuit substrate so that said at least one clip member and said at least one electrode make electrical contact when said circuit substrate is inserted into said clip member.
A hybrid integrated circuit comprising:
- a circuit substrate including an insulation substrate with at least one electronic device mounted thereon and with a patterned wiring having electrodes all formed in a single line along one side of said insulation substrate, said electrodes being connected to respective lead terminals;
- and
- a metal conductor member including a plate portion with plural L-shaped clip members, formed along a side thereof corresponding to said one side of said circuit substrate, for holding said circuit substrate inserted into said clip members, said insulation substrate being adhered to said metal conductor member over substantially an entire surface area of the plate portion by an insulate adhesive,
- said clip members being formed at places corresponding to electrodes selected from said electrodes formed along one side of said insulation substrate so that said each of said clip members and each of said selected electrodes make electrical contact when said circuit substrate is inserted into said clip means.
A hybrid integrated circuit comprising:
- an insulation substrate having outer edges defining a mounting surface for mounting at least one electronic device thereon, and a non-mounting surface facing directly opposite the mounting surface;
- and
- a metal conductor member including,
- a plate portion, having outer edges substantially corresponding in dimension to the outer edges defining the non-mounting surface of said insulation substrate;
- and
- an insulate adhesive contacting the non-mounting surface of said insulation substrate,
- said insulation substrate adhered to said metal conductor member over substantially an entire surface area of the plate portion of said metal conductor member.
Dependencies are inferred from the claim text.