Electronic assembly with porous heat exchanger and orifice plate

An electronic assembly, comprising:

• a first substrate comprising
• a porous planar first heat exchanger, and
• a first orifice plate overlying and thermally contacting the first heat exchanger, the first orifice plate having a first plurality of apertures therethrough;
• a first electronic device mounted to the first orifice plate;
• a second substrate comprising
• a porous planar second heat exchanger, and
• a second orifice plate overlying and thermally contacting the second heat exchanger, the second orifice plate having a second plurality of apertures therethrough;
• a second electronic device mounted to the second orifice plate, the second substrate being positioned in a facing but spaced apart relation to the substrate;
• and
• means for forcing a flow of coolant through the porous planar first heat exchanger and the first orifice plate, and thereafter through the porous planar second heat exchanger and the second orifice plate.

An electronic assembly, comprising:

• a substrate, comprising
• a patterned electrical interconnect layer, and
• a planar heat exchanger assembly, the planar heat exchanger assembly comprising
• an orifice plate having a plurality of apertures therethrough, a first side of the orifice plate being joined to the interconnect layer and
• a porous planar heat exchanger in thermal contact with a second side of the orifice plate;
• an assembly of electronic devices mounted to electrical interconnect layer of the substrate;
• and
• a plurality of electrical interconnects extending between the assembly of electronic devices and the patterned electrical interconnect layer.