Electrostatic discharge protection device
AssigneePolaroid Corporation
InventorsArnold W. Johansen, David V. Cronin
Life of this patent
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Abstract
An electrostatic discharge protection device is disclosed for use with a semiconductor chip package where the electrostatic discharge protection device establishes electrical connection between connector pins on the semiconductor chip package and ground, thereby creating a short circuit to protect the semiconductor chip package from electrostatic discharge. The electrostatic discharge protection device is manually operable to engage or disengage a ground connection while remaining attached to the semiconductor chip package. The electrostatic discharge protection device is also removable from the semiconductor chip package either prior to or subsequent to mating a semiconductor chip package with a printed circuit board or other receptacle.
Claims16
An electrostatic discharge protection device suitable for use with a semiconductor chip package of a type having a housing with a surface at electrical ground potential, one or more connector pins extending from and electrically isolated from the ground surface, and a ground pin extending from and electrically connected to the ground surface, said electrostatic discharge protection device comprising:
- one or more grounding means disposed on said one or more connector pins, said electrostatic discharge protection device having an operating position in which there is established an electrical connection between each connector pin and the ground surface, and an inoperative position in which there is no electrical connection between each connector pin and the ground surface, said grounding means comprising clamp means for frictionally securing said grounding means to one pin such that said grounding means is releasably fixed adjacent the ground surface in the operative position and releasably fixed distal from the ground surface in the inoperative position.
An electrostatic discharge protection device for use with a semiconductor chip package of a type having a housing with a surface at electrical ground potential, one or more connector pins extending from and electrically isolated from the ground surface, and a ground pin extending from and electrically connected to the ground surface, said electrostatic discharge protection device comprising:
- grounding means comprising two or more receiving holes for engaging a respective connector pin, said electrostatic discharge device being biased such that edges of two said receiving holes mechanically interact with the one respective connector pin so as to frictionally secure said electrostatic discharge protection device to the semiconductor chip package, said grounding means serving to selectively establish an electrical connection between the connector pins and the ground surface.
Dependencies are inferred from the claim text.