Use of fiducial marks for improved blank wafer defect review

A method for analyzing defects on a wafer after manufacturing steps in at least two processing tools, the method comprising:

• placing at least two fiducial marks on a wafer;
• recording position coordinates of the at least two fiducial marks;
• detecting initial defects on the wafer and recording position coordinates of the initial defects in relation to the position of the at least two fiducial marks;
• placing the wafer in a first process tool;
• detecting a first set of additional defects on the wafer caused by the first process tool and recording position coordinates of the first set of additional defects in relation to the at least two fiducial marks;
• placing the wafer in an analysis tool;
• performing de-skew calculations using the position coordinates of the at least two fiducial marks;
• and
• navigating directly to the recorded position of each of the first set of additional defects on the wafer at high magnification.