US 5,847,571 AGranted

Membrane probing of circuits

AssigneeMicroModule Systems

InventorsKen Kuang-Fu Liu, Byoung-Youl Min, Kunio Sano, Takashi Sato

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Abstract

First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester. A probe frame is bonded to the substrate between connector frames bonded at opposite ends of the substrate. Alternatively, a pair of bumps exposed on the same surface of a flexible substrate are electrically connected at different positions along a conductive run. One of the bumps is oriented for contact with a pad of a die under test, and the other is in contact with a pad on a surface of a printed circuit board directed away from the die. The pad of the printed circuit board is provided for electrical connection to a tester.

Claims3

Dependent claims

Apparatus for providing a conductive path from a pad of a die under test to a pad of a tester structure, said apparatus comprising:

a generally rectangular flexible substrate having surfaces and bearing a conductive run;
a first electrically conductive bump exposed on one of said surfaces and electrically connected at a first position along said conductive run, said first bump oriented for contact with said pad of said die under test;
a second electrically conductive bump exposed on one of said surfaces and electrically connected at a second position along said conductive run, said second bump oriented for contact with said pad of said tester structure;
said first bump and said second bump being exposed on the same one of said surfaces;
a pair of connector frames bonded at opposite ends of said substrate, at least one of said connector frames enclosing an open region spanned by only a portion of said substrate including said second bump;
and
a probe frame bonded to said substrate at a position between said connector frames, said probe frame enclosing an open region spanned by only a portion of said substrate including said first bump.

4 more elements

Dependencies are inferred from the claim text.