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US 5,847,456 AGranted
Semiconductor device
AssigneeNEC Corporation
InventorKazutaka Shoji
Life of this patent
Estimating the term…
Abstract
Solder bumps (3) are provided with reinforcing resins (4), which are formed by applying resins thickly at the roots and gradually thinly toward the tips so as to surround the bumps. Thus, long-time reliability of solder connection parts is improved and repairability is simultaneously improved.
Claims6
A semiconductor device comprising a semiconductor substrate in which a wiring pattern is formed, said wiring pattern having terminal pads;
- solder bumps bonded at their roots to said terminal pads, said solder bonds being at least partially deformed at the contact area between said solder bump and said terminal pad, thereby providing a relatively flat surface area;
- and
- an electrically non-conductive resin applied to the solder bumps, said resin being applied relatively thickly at the roots of the solder bumps, and tapering relatively thinly toward the tips of the solder bumps.
Dependencies are inferred from the claim text.