Molded leadframe ball grid array
AssigneeVLSI Technology, Inc.
InventorKamran Manteghi
Life of this patent
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Abstract
A ball grid array (BGA) package configuration for packaging an integrated-circuit die includes a lead frame having a plurality of inwardly-extending bonding fingers and a centrally-located die-attach pad. The bonding fingers are disposed peripherally surrounding the die-attach pad. An integrated-circuit die is mounted on the die-attach pad. Bonding fingers are interconnected between the bonding pads on the integrated-circuit die and the plurality of bonding fingers. A plastic material is molded over the top of the lead frame and the die while still providing an exposed bottom surface of the bonding fingers on the lead frame. A solder mask is disposed over the bottom of the lead frame so as to form selective solder areas. Solder balls are attached to the selective solder areas.
Claims10
A ball grid array package configuration having no substrate for packaging an integrated-circuit die comprising:
- a lead frame having a plurality of inwardly-extending bonding fingers and a centrally-located die-attach pad, said bonding fingers being disposed peripherally surrounding said die-attach pad;
- an integrated-circuit die being directly mounted on said die-attach pad;
- bonding wires interconnected between bonding pads on said integrated-circuit die and said plurality of bonding fingers;
- a plastic material being encapsulated over the top of said lead frame and said die while still providing an exposed bottom surface of said bonding fingers on said lead frame;
- a solder mask layer being disposed over the exposed bottom surface of said lead frame so as to form selective solderable areas;
- and
- solder balls being attached to said selective solderable areas.
Dependencies are inferred from the claim text.