Semiconductor chip package having chip attach pad with perimeter slots

A semiconductor chip package comprising:

• a semiconductor chip having a first surface, a second surface, outer edges extending between said first and second surfaces, and a plurality of input/output pads at said first surface;
• a chip attach pad bonded to said second surface of said semiconductor chip, said chip attach pad having an inner central region, an outer peripheral region, a perimeter region separating said inner central region from said outer peripheral region, and at least one slot in said perimeter region, each said at least one slot extending longitudinally in the direction of said outer edges of said semiconductor chip, and said outer edges being located along said at least one slot such that lower surfaces of the chip meeting said outer edges are exposed through said at least one slot;
• a plurality of leads arranged around said semiconductor chip, each of said leads corresponding to a respective one of said input/output pads;
• bonding wires electrically coupling respective end portions of said leads to said input/output pads;
• and
• a molding compound encapsulating said chip, said chip attach pad, said bonding wires, and the end portions of said leads.