Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same
AssigneeMicron Technology, Inc.
InventorsJames M. Wark, Salman Akram
Life of this patent
Estimating the term…
Abstract
A rail of non-conductive material is applied to a semiconductor die and/or to the carrier substrate to which it is or will be bonded. The rail underlies those wires joining the die bond pads and substrate traces, which wires have an inordinate length, i.e. greater than about 100 mils for 1.0 mil diameter wires, to prevent sagging wires from contacting the die edge and breaking, or shorting to active areas on the die or substrate. A pattern of rails may be formed on the dice of an undivided wafer by, for example, screen printing. Rails may also be formed on the substrate, and rails on the substrate employed in combination with rails on dice carried thereon.
Claims75
A semiconductor device, comprising:
- a carrier substrate having a pattern of conductors on at least a first non-conductive surface thereof;
- at least one semiconductor die having an active surface on a first side and an opposed side secured to said first surface of said substrate, said die having at least one bond pad remote from a peripheral edge of said active surface;
- a bond wire connecting at least one conductor of said pattern on said substrate with said at least one remote bond pad, said bond wire extending over said peripheral edge of said active surface of said at least one die and having an intermediate portion between said at least one remote bond pad and said at least one conductor of sufficient length as to be non-self-supporting;
- and
- a support having an electrically insulating upper surface disposed under and supporting said intermediate bond wire portion.
A semiconductor die having an active surface for wire bonding to a remote substrate, said die comprising:
- a body of semiconductor material having a region on said active surface remote from a periphery of said active surface;
- at least one exposed bond pad within said region;
- and
- a rail of non-conductive material attached to said active surface in a predetermined position intermediate said at least one bond pad and said periphery of said active surface to support a wire to be bonded to said at least one bond pad.
A structure for accommodating a semiconductor die having at least one electrically conductive bond pad remote from a die edge for bonding a wire thereto and to a conductive trace on said structure, said structure comprising:
- a carrier having a first non-conductive surface;
- electrically conductive traces comprising at least part of an electrical circuit on said first surface of said carrier;
- a selected die attach area on said first surface for attaching said semiconductor die thereto;
- and
- a rail of non-conductive material applied and bonded to said first surface adjacent said selected die attach area and projecting upwardly between an electrically conductive trace and said die attach area.
A method for making a semiconductor device from a die having an active surface bearing bond pads remote from a periphery of said active surface and a carrier substrate bearing conductive traces, comprising:
- attaching said die to said substrate;
- applying a bead of non-conductive material to form an upstanding rail between at least some of said bond pads and an edge of said active surface;
- and
- bonding wires between at least some of said bond pads and corresponding conductive traces, said bond wires passing over said rail therebetween.
A method for making a semiconductor device from a die having an active surface bearing bond pads remote from a periphery of said active surface and a carrier substrate bearing conductive traces, comprising:
- attaching said die to said substrate;
- applying a bead of non-conductive material proximate said periphery of said active surface to form an upstanding rail between said bond pads and said periphery of said active surface;
- and
- bonding wires between at least some of said bond pads and corresponding conductive traces, said bond wires passing over said rail therebetween.
A method for making a semiconductor device from a die and a carrier substrate, comprising:
- attaching a die having an active surface bearing exposed bond pads remote from a periphery of said active surface to a carrier substrate bearing conductive traces thereon;
- applying a bead of non-conductive material to said carrier substrate to form an upstanding rail between said die and said conductive traces;
- and
- bonding wires between at least some of said bond pads and corresponding conductive traces and over said rail therebetween.
A method for making a semiconductor device from a lead-over-chip (LOC) die having an active surface bearing a bond pad remote from a periphery of said active surface and a carrier substrate bearing a conductive trace thereon, comprising:
- screen printing an upstanding rail of non-conductive polymeric material on said active surface to underlie a wire subsequently bonded between said bond pad and said conductive trace;
- attaching said die to said substrate;
- and
- bonding said bond wire between said bond pad and said conductive trace, said bond wire passing over said rail therebetween.
A method for making a semiconductor device from a lead-over-chip (LOC) die having electrical wire bond pads along a central axis and a carrier substrate bearing conductive traces, comprising:
- forming a rail of insulating material on said substrate, said rail positioned in a predetermined location to lie beneath a subsequently attached wire connected between a bond pad of said die and a conductive trace of said substrate;
- bonding an LOC die to said substrate adjacent said rail;
- and
- connecting a wire to said bond pad and to said conductive trace, said bond wire passing over said rail therebetween.
A semiconductor device, comprising:
- a carrier substrate having at least one conductive trace on at least a first surface thereof;
- at least one semiconductor die having an active surface on a first side thereof and an opposed side attached to the first surface of the carrier substrate, the at least one die having at least one exposed bond pad remote from a periphery of the active surface proximate the at least one conductive trace;
- at least one wire connecting the at least one conductive trace with the at least one bond pad;
- and
- an electrically insulating support disposed under the at least one wire intermediate the at least one bond pad and the at least one conductive trace.
A method of making a semiconductor die for wire-bonding, comprising:
- providing a substrate of semiconductor material having an active surface with a plurality of semiconductor die locations defined thereon, each of said locations including a plurality of bond pads;
- and
- placing insulating support members on said semiconductor substrate active surface at said plurality of semiconductor die locations.
A method of fabricating a carrier substrate for supporting a plurality of semiconductor dice in a multi-chip module configuration, comprising:
- providing a carrier substrate having a plurality of die-attach locations thereon and carrying conductive traces in a pattern arranged for effecting wire bonds between at least some of said conductive traces and semiconductor dice secured to said support member at said die-attach locations;
- and
- placing insulating support members on said carrier substrate proximate at least some of said plurality of die-attach locations and between said at least some of said plurality of locations and at least some of said conductive traces proximate those die-attach locations.
Dependencies are inferred from the claim text.