Apparatus and method for controlling the temperature of an integrated circuit under test

A method for transferring heat from the surface of a heat generating device, said method comprising the steps of:

• applying a first force to a bellows having a planar surface disposed at one end such that said planar surface makes intimate contact with said surface of said heat generating device and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows into a heat transfer medium reservoir;
• and
• applying a second force to said bellows such that said planar surface is removed from said surface of said heat generating device and wherein said bellows expands such that at least a portion of said heat transfer medium residing in said reservoir is drawn into said bellows.

A method for transferring heat from the backside of a semiconductor die, said method comprising the steps of:

• applying a first force to a bellows having a heat slug disposed at one end such that said heat slug makes intimate contact with said backside of said die and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows;
• and
• applying a second force to said bellows such that said heat slug is removed from said backside of said die and wherein said bellows expands causing said heat transfer medium to flow into said bellows.

A method for transferring heat from a semiconductor die, said method comprising the steps of:

• applying a first force to a bellows having a first heat slug disposed at one end such that said heat slug makes intimate contact with a second heat slug that is coupled to said die and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows;
• and
• applying a second force to said bellows such that said first heat slug is removed from said second heat slug and wherein said bellows expands causing said heat transfer medium to flow into said bellows.