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US 5,846,476 AGranted
Optical curing process for intergrated circuit package assembly
AssigneeTexas Instruments Incorporated
InventorsMing Hwang, Leslie E. Stark, Gail Heinen, Leo Rimpillo
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Abstract
In semiconductor device assembly operations, the use of an optical heat source 28, such as a tungsten halogen lamp module, is to replace ovens and heater blocks for curing die-attach material and molding compound with reduction in cycle time, cost, footprint, and contamination.
Claims1
A method of curing a mold compound used to encapsulate a semiconductor device, comprising the steps of:
- encapsulating the semiconductor device with a mold compound by transfer molding;
- and
- curing the mold compound by exposing the encapsulated semiconductor device to an unfocused near infrared lamp emitting light having a wavelength between 0.8 microns and 2.8 microns wherein the current through the lamp is varied during curing.
Dependencies are inferred from the claim text.