Method for forming a patterned metallic layer in a thin film magnetic head
AssigneeDaewoo Electronics Co., Ltd.
InventorJae-Woo Roh
Life of this patent
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Abstract
A method for forming a patterned metallic layer on a substrate is employed to form a first layer on top surface of the substrate. A patterned mask layer is then deposited on top of the first layer, thereby exposing selected portions of the first layer. Thereafter, a second and a third layers are successively formed on top of the selected portions of the first layer, and the patterned mask layer is removed. Subsequently, the first layer is removed except the portions thereof intervening between the top surface of the substrate and the second layer by using a dry etching method to thereby form the patterned metallic layer including the second layer and the exposed portions of the first layer.
Claims6
A method, for use in fabricating a thin film magnetic head, for forming a patterned coil layer on a top surface of a substrate, the top surface of the substrate being made of an insulating material and having a stepped surface profile, the method comprising the steps of:
- (a) depositing a first seed layer and a second seed layer successively on the top surface of the substrate;
- (b) providing a patterned mask layer on top of the second seed layer, thereby exposing selected portions of the second seed layer;
- (c) electroplating a metallic layer on top of the selected portions of the second seed layer;
- (d) depositing a first protection layer and a second protection layer in succession on top of the metallic layer;
- (e) removing the patterned mask layer;
- and
- (f) dry etching the substrate provided from step (e) until the first and the second seed layers are completely removed except the portions thereof under the metallic layer to form the patterned coil layer.
Dependencies are inferred from the claim text.