Method for interconnecting an electronic device using a transferable solder carrying medium
AssigneeLucent Technologies Inc.
InventorsSungho Jin, Mark Thomas McCormack
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Abstract
In accordance with the invention, an electronic device having one or more contact pads is placed in contact with a carrier sheet bearing an array of transferable solder particles. Heat is applied to adhere the solder to the contact pads, and solder is selectively transferred onto the contact pads. In a preferred embodiment the solder-carrying medium comprises elastomeric material and the solder particles comprise solder-coated magnetic particles. Application of a magnetic field while the elastomer is curing produces a regular array of solder coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.
Claims5
A method for connecting an electronic device having one or more electrical contact pads to a second device comprising the steps of:
- providing said electronic device having one or more contact pads;
- providing a carrier sheet having a plurality of solder balls transferably disposed thereon, said solder balls randomly distributed on said carrier sheet and having diameters in the range 0.5 to 50 .mu.m;
- adhering said device to solder balls on said carrier sheet to adhere a plurality of solder balls to each contact pad;
- transferring the adhered solder balls to said contact pads;
- and
- placing the solder-carrying pads in contact with said second device.
Dependencies are inferred from the claim text.