High strength high conductivity Cu-alloy of precipitate growth suppression type and production process

A process for producing a high strength and high electrical conductivity copper alloy without a step of solution treatment, comprising the steps of:

• melting and casting raw material to obtain an ingot consisting of 0.5.about.4.0 wt % nickel, 0.1.about.1.0 wt % silicon, 0.05.about.0.8 wt % tin (Sn) and balance copper and inevitable impurities;
• surface machining and cold rolling of the ingot;
• subjecting the cold rolled ingot to a precipitation process at a temperature ranging 450.about.520 deg. C. for 5.about.12 hours;
• cold rolling the precipitation processed material;
• and
• subjecting the cold rolled material to a tension annealing process at a temperature ranging 350.about.550 deg. C. for below 90 seconds,
• wherein sizes of precipitate particles are below 0.5 .mu.m, and a density of precipitate particles is in a range of 19-24 per .mu.m.sup.2.

A process for producing a high strength and high electrical conductivity copper alloy without a step of solution treatment, comprising the steps of:

• melting and casting raw material to obtain an ingot consisting of 0.5.about.3.0 wt % nickel, up to 1 wt % iron, 0.1.about.1.0 wt % silicon, 0.05.about.0.8 wt % tin (Sn) and balance copper and inevitable impurities;
• surface machining and cold rolling of the ingot;
• subjecting the cold rolled ingot to a precipitation process at a temperature ranging 450.about.520 deg. C. for 5.about.12 hours;
• cold rolling the precipitation processed material;
• and
• subjecting the cold rolled material to a tension annealing process at a temperature ranging 350.about.550 deg. C. for below 90 seconds,
• wherein sizes of precipitate particles are below 0.5 .mu.m, and a density of precipitate particles is in a range of 19-24 per .mu.m.sup.2.

A process for producing a high strength and high electrical conductivity copper alloy without a step of solution treatment, comprising the steps of:

• melting and casting raw material to obtain an ingot consisting of 0.5.about.3.0 wt % nickel, up to 1 wt % cobalt, 0.1.about.1.0 wt % silicon, 0.05.about.0.8 wt % tin (Sn) and balance copper and inevitable impurities;
• surface machining and cold rolling of the ingot;
• subjecting the cold rolled ingot to a precipitation process at a temperature ranging 450.about.520 deg. C. for 5.about.12 hours;
• cold rolling the precipitation processed material;
• and
• subjecting the cold rolled material to a tension annealing process at a temperature ranging 350.about.550 deg. C. for below 90 seconds,
• wherein sizes of precipitate particles are below 0.5 .mu.m, and a density of precipitate particles is in a range of 19-24 per .mu.m.sup.2.