Substrate spin treating apparatus

Abstract

A substrate spin treating apparatus includes a spin chuck for supporting a substrate in a horizontal posture and spinning the substrate about a vertical axis. A nozzle is provided for supplying a treating solution to the substrate supported by the spin chuck, and a scatter preventive cup in disposed to surround the substrate on the spin chuck and has an inclined surface extending around an entire inner circumference of the cup for downwardly guiding sprays of the treating solution and the like formed by a spinning of the substrate. The scatter preventive cup includes an inner skirt extending around an entire circumference adjacent an upper end of the inclined surface The inner skirt has a surface opposed to the inclined surface and bent away from a spin center of the substrate. This construction suppresses the treating solution from adhering to and accumulating on portions, adjacent the upper end of the inclined surface, of the surface of the inner skirt opposed to the inclined surface. During cup rinsing, a rinsing solution spreads well over that surface of the inner skirt.

Dependencies are inferred from the claim text.