Semiconductor package, and semiconductor device using the same
AssigneeLG Semicon Co., Ltd.
InventorSin Choi
Life of this patent
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Abstract
A semiconductor package is provided. A semiconductor chip including bonding pads has a plurality of leads disposed on and attached to the upper surface of the semiconductor chip. The leads include bonding tips that are electrically connected to the bonding pads by bonding wires. A molding compound encapsulates the chip and portions of the leads. Upper portions of the leads extend from the molding compound. The exposed upper portions of the leads may be connected to a circuit board. Heat dissipation from the semiconductor chip is facilitated with the disclosed package.
Claims20
A semiconductor package comprising:
- a semiconductor chip having a top surface and bonding pads on the top surface of the semiconductor chip;
- a plurality of leads secured to the top surface of the semiconductor chip, wherein each of the leads include an upper portion and a bonding tip;
- bonding wires for electrically connecting the bonding pads to the bonding tips;
- and
- molding compound encapsulating the semiconductor chip and the bonding tips, wherein the upper portions of the leads are exposed from a top surface of the molding compound.
A semiconductor device comprising:
- a semiconductor chip having a top surface, wherein the semiconductor chip includes a plurality of bonding pads on the top surface of the semiconductor chip;
- a plurality of leads secured to the semiconductor chip, wherein each of the leads includes a bonding portion and a length including an upper portion;
- bonding wires for electrically coupling the bonding pads to the bonding portions;
- and
- a molding compound encapsulating the chip and the bonding portions of the leads, wherein the upper portions of the leads extend from a top surface of the molding compound and are not encapsulated by the molding compound.
Dependencies are inferred from the claim text.