Method for testing semiconductor packages using decoupling capacitors to reduce noise

A method for testing a semiconductor package comprising:

• providing a test apparatus comprising an electrical connector for establishing electrical communication with the package;
• providing a thin film capacitor comprising a first electrode and a second electrode separated by a dielectric layer, said first electrode in electrical communication with a first electrode contact, said second electrode in electrical communication with a second electrode contact;
• mounting the capacitor on the connector with the first electrode contact in direct physical and electrical contact with a first lead of the package and with the second electrode contact in direct physical and electrical contact with a second lead of the package;
• and
• applying test signals to the first and second leads.

A method for testing a semiconductor package having a plurality of external leads comprising:

• forming a thin film capacitor comprising a first electrode and a second electrode separated by a dielectric layer, said first electrode in electrical communication with a first electrode contact, said second electrode in electrical communication with a second electrode contact;
• placing the first electrode contact and the second electrode contact in direct physical and electrical contact with selected leads of the package;
• and
• applying test signals to the selected leads.

A method for testing a semiconductor package comprising:

• providing a test apparatus comprising an electrical connector comprising a first contact member for electrically contacting a first lead of the package and a second contact member for electrically contacting a second lead of the package;
• providing a thin film capacitor comprising a first electrode and a second electrode separated by a dielectric layer, said first electrode in electrical communication with a first electrode contact, said second electrode in electrical communication with a second electrode contact;
• and
• mounting the capacitor on the connector with the first electrode contact in direct contact with the first contact member of the connector and with the second electrode contact in direct contact with the second contact member of the connector.

A method for testing a semiconductor package comprising a die with integrated circuits formed thereon, said method comprising:

• providing a test apparatus configured for applying test signals to the integrated circuits, said test apparatus comprising an electrical connector with a plurality of contact members for establishing electrical communication with the package;
• mounting a thin film capacitor on the electrical connector, said capacitor including a first electrode and a second electrode separated by a dielectric layer;
• and
• mounting the package on the capacitor with select contact members of the test apparatus in electrical communication with the first electrode or the second electrode and with select leads of the package.

A system for testing a semiconductor package comprising:

• a burn-in board comprising an electrical connector for establishing electrical communication with the package;
• a thin film capacitor mounted to the connector, said capacitor comprising a first electrode and a second electrode separated by a dielectric layer;
• a first contact on the first electrode and configured to directly contact a power lead for the package;
• and
• a second contact on the second electrode and configured to directly contact a ground lead for the package.