Carrier having interchangeable substrate used for testing of semiconductor dies

An apparatus for testing semiconductor dice, comprising:

• a base;
• a substrate mounted to the base comprising a plurality of first contacts configured to electrically engage a plurality of contact locations on a die, and a plurality of second contacts in electrical communication with the first contacts;
• a plurality of third contacts formed on the base as a latching mechanism for retaining the substrate on the base, each third contact comprising a first portion configured to electrically contact a second contact on the substrate and a second portion configured for electrical connection to test circuitry;
• and
• a release mechanism on the base configured to release the third contacts from the substrate to permit mounting of a second substrate to the base for testing a second die using the base.

An apparatus for testing semiconductor dice, comprising:

• a base;
• a substrate mounted to the base comprising a plurality of first contacts configured to electrically engage a plurality of contact locations on a die, and a plurality of second contacts in electrical communication with the first contacts;
• and
• a plurality of third contacts formed on the base as a latching mechanism for retaining the substrate on the base, each third contact comprising a first portion configured to electrically engage a second contact on the substrate, a second portion configured for electrical connection to test circuitry, and a lever portion engageable to release the third contacts from the second contacts for replacing the substrate with a second substrate for testing a second die.