Loading patent…
AssigneeU.S. Philips Corporation
InventorPierre Baudet
Estimating the term…
A semiconductor device comprises a chip soldered to a support. The chip comprises a semiconductor substrate, a via a ground plane on a rear surface, and an anti-adhesion layer deposited continuously inside the via. A solder layer which does not wet the anti-adhesion layer but which does wet the ground plane has a globular shape in the via opening and makes no mechanical contact with the walls of the via. The manufacturing process comprises the sandwiching of a soldering preform between the support and the rear surface provided with the ground plane and said anti-adhesion layer, and melting of the preform under pressure so that the solder rises in globular shape inside the via. The anti-adhesion layer is realized without mask.
A semiconductor device comprising a chip (7), with a semiconductor substrate (10) having a front surface (10a) and a rear surface (10b), a conductor element (2) of a circuit on said front surface (10a), a via opening (16) extending through the substrate and having lateral walls (10c) and a bottom (16c) which coincides with the conductor element (2), a conductive layer or ground plane (12) covering said rear surface and the lateral walls (10c) and the bottom (16c) of the via opening and forming a connection to the conductor element, and a support (20) with a receiving surface (20a) on which the chip is soldered with its rear surface,
Dependencies are inferred from the claim text.