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US 5,844,320 AGranted
Semiconductor unit with semiconductor device mounted with conductive adhesive
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMasahiro Ono, Yoshihiro Bessho
Life of this patent
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Abstract
A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two kinds of conductive adhesive, and a method for manufacturing the semiconductor unit.
Claims5
A semiconductor unit comprising a semiconductor device, which comprises protruding electrodes, mounted onto terminal electrodes of a circuit board;
- wherein said protruding electrodes of said semiconductor device are electrically connected to said terminal electrodes of said circuit board through a bonding layer comprising at least two different kinds of conductive adhesive.
Dependencies are inferred from the claim text.