Low-profile microelectronic package

A microelectronic package comprising:

• a polymeric body comprising a perimeter, a first surface, and a second surface opposite the first surface;
• an integrated circuit die having an active face, a generally planar non-active face, and a plurality of die bond pads located on the active face, said integrated circuit die being embedded into the first surface of the polymeric body such that the active face is covered by the polymeric body;
• a plurality of metallic leads embedded into the first surface of the polymeric body, each said metallic lead having an inner surface, a die proximate end adjacent to the integrated circuit die, and a perimeter end opposite the die proximate end;
• a plurality of wire leads embedded into the polymeric body and connecting the die bond pads to the die proximate ends;
• and
• a plurality of solder bumps bonded to the inner surface of the metallic leads intermediate each said wire lead and each said perimeter end, each said solder bump extending through the polymeric body and having a bonding surface exposed at the second surface to provide access for forming solder interconnections.

A microelectronic assembly comprising:

• a printed circuit board comprising a substrate and a plurality of board bond pads located on the substrate;
• a microelectronic package comprising a polymeric body having a first polymeric body surface and a second polymeric body surface opposite the first surface, an integrated circuit die having an active face embedded into the polymeric body, a plurality of metallic leads embedded into the polymeric body adjacent to the integrated circuit die, the metallic leads having outer surfaces exposed adjacent to the first polymeric body surface and inner surfaces opposite the outer surfaces, a plurality of wire leads embedded into the polymeric body and connecting the active face of the integrated circuit die to the metallic leads, and a plurality of metallic bumps bonded to the metallic leads and extending through the polymeric body from the inner surfaces to protrude from the second polymeric body surface, each said metallic bump comprising a bonding surface opposite each said metallic lead;
• and
• a plurality of solder interconnections connecting the board bond pads to the metallic bumps.