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US 5,844,314 AGranted
Bump comprising protuberances and a method of forming the same
AssigneeLG Electronics Inc.
InventorSeong Jin Kim
Life of this patent
Estimating the term…
Abstract
A bump structure with a recessed portion, as defined by a projection, which collects conductive balls suspended in an ACF when forming a bond between an IC and a liquid crystal panel using the chip-on-glass method. The bump structure improves the electrical contact between the bump and the pad, as well reduce the migration of conductive balls into open areas between aligned bumps during the bonding process.
Claims25
A liquid crystal display comprising:
- a pad connected to a thin film transistor (TFT) array formed on a transparent substrate;
- an integrated circuit (IC) for generating a signal to operate the TFT array, the IC including an electrode for transmitting the signal generated from the IC to the pad;
- a bump formed on the electrode, the bump being made of a low resistance metal;
- and
- bonding means, disposed between the pad and the bump formed on the electrode of the IC, for electrically contacting the electrode of the IC and the pad, the bonding means including a plurality of conductive particles,
- wherein the bump has a collecting end which entraps the conductive particles between the bump and the pad.
3 more elements
A semiconductor device comprising:
- an electrode;
- a pad;
- a bump formed on the electrode;
- and
- connecting means for connecting the pad and the bump, the connecting means including a plurality of conductive particles dispersed therein, wherein a portion of the bump which contacts the pad includes a projection for entrapping conductive particles between the bump and the pad.
2 more elements
A semiconductor device comprising:
- an electrode;
- a pad;
- a bump formed on the electrode;
- connecting means for conducting the bump and the pad, the connecting means including a plurality of conductive particles, wherein the number of conductive particles bonded to an outer peripheral surface of the bump is greater than the number of conductive particles bonded to a central surface of the bump facing the pad.
1 more element
A bump device comprising:
- an electrode;
- and
- a bump formed on the electrode, the bump including a projection having a pre-determined height and a pre-determined width, the projection formed on an outer peripheral edge of a surface of the bump opposing the surface of the bump facing the electrode.
Dependencies are inferred from the claim text.