Multichip module with heat sink and attachment means
AssigneeHitachi, Ltd.
InventorsHideki Watanabe, Kenichi Kasai, Tositada Netsu, Hiroyuki Hidaka, Osamu Yamada, Mitsunori Tamura
Life of this patent
Estimating the term…
Abstract
There is disclosed a multichip module having a sealing-cooling structure which achieves a high packaging density, high sealing-connection reliability, a low manufacturing cost and a high cooling ability. A frame 15, conforming in thermal expansion coefficient to a substrate 11, is soldered at one surface thereof to that surface of the substrate 11 on which semiconductor devices 12 are mounted. The frame 15 is fastened or fixedly secured at the other surface thereof to a lid member 17 by bolts 10 or means without any heat treatment of the whole of the module.
Claims6
A multichip module comprising:
- a substrate having a plurality of semiconductor devices mounted on one side thereof, and input/output pins formed on the other side of said substrate;
- a frame made of a material conforming to said substrate with respect to thermal expansion coefficient;
- a single integral lid member which is itself a heat sink, said lid member being made of a single material having a thermal expansion coefficient different from that of said substrate;
- thermal conduction means provided between each of said plurality of semiconductor devices and said lid member;
- means for fixedly securing said substrate and said frame together which means is accompanied with a heat treatment of the whole of said module;
- and
- means for connecting said frame and said lid member together which means is one of mechanical fastening means and fixedly-connecting means which is performed without any heat treatment of the whole of said module.
Dependencies are inferred from the claim text.