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AssigneesHitachi Metals, Ltd., Nippon Steel Corporation
InventorsSusumu Okikawa, Saburou Kitaguchi
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A heat spreader for a semiconductor device is constituted by an integral laminate of alternatingly stacked and diffusion-bonded Fe-Ni alloy sheets and copper-group metal sheets, the laminate having a one-directional stripe pattern of the Fe-Ni alloy sheets and the copper-group metal sheets, which appears on a planar surface on which a silicon chip is disposed. It is produced by (a) alternatingly stacking Fe-Ni alloy sheets and copper-group metal sheets, (b) hot isostatic-pressing the resulting stack of the metal sheets to form a slab, (c) rolling the slab vertically to the laminating direction of the metal sheets to form an integrated stripe-pattern laminate, and (d) cutting the integrated stripe-pattern laminate to a predetermined shape.
A heat spreader for a semiconductor device comprising an integral laminate of alternatingly stacked and diffusion-bonded Fe-Ni alloy sheets and copper-group metal sheets, said laminate having a one-directional stripe pattern of said Fe-Ni alloy sheets and said copper-group metal sheets on a planar surface on which a silicon chip is mounted and a surface opposite to said planar surface.
A heat spreader for a semiconductor device comprising a center portion made of an Fe-Ni alloy, outer portion made of a copper-group metal, and a peripheral portion made of titanium, each portion penetrating from a chip-bearing surface to the opposite surface.
A semiconductor device comprising a heat spreader constituted by an integral laminate of alternatingly stacked and diffusion-bonded Fe-Ni alloy sheets and copper-group metal sheets, said laminate having a one-directional stripe pattern of said Fe-Ni alloy sheets and said copper-group metal sheets on a planar surface on which a silicon chip is mounted and a surface opposite to said planar surface.
A semiconductor device comprising a heat spreader comprising a center portion made of an Fe-Ni alloy, an outer portion made of a copper-group metal, and a peripheral portion made of titanium, each portion penetrating from a chip-bearing surface to the opposite surface.
Dependencies are inferred from the claim text.