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US 5,844,307 AGranted
Plastic molded IC package with leads having small flatness fluctuation
AssigneeNEC Corporation
InventorsKatsunobu Suzuki, Akira Haga
Life of this patent
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Abstract
In a plastic molded IC package, a metal pattern and leads are formed on a first surface of an insulating layer, and a conductive pattern connected to a semiconductor chip is formed on a second surface of the insulating layer. The conductive pattern is connected to the leads via through holes in the insulating layer.
Claims18
A semiconductor package comprising:
- an insulating layer having first and second surfaces;
- a ground pattern formed on the first surface of said insulating layer;
- leads formed on the first surface of said insulating layer;
- a conductive pattern having a plurality of stripes whose pitch is larger on an outer side than on an inner side and formed on the second surface of said insulating layer and connected via through holes of said insulating layer to said leads;
- a semiconductor chip connected to said conductive pattern;
- and
- a molding resin envelope sealing said semiconductor chip.
4 more elements
A semiconductor package comprising:
- an insulating layer having first and second surfaces;
- isolated first and second metal patterns formed on the first surface of said insulating layer;
- leads formed on the first surface of said insulating layer;
- a conductive pattern having a plurality of stripes whose pitch is larger on an outer side than on an inner side and formed on the second surface of said insulating layer and connected via through holes of said insulating layer to said leads;
- a semiconductor chip formed on the second surface of said insulating layer and connected to said conductive pattern;
- and
- a molding resin envelope sealing said semiconductor chip.
4 more elements
Dependencies are inferred from the claim text.