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US 5,844,217 AGranted
Appratus for liquid thermosetting resin molding using radiofrequency wave heating
AssigneeBoard of Trustees operating Michigan State University
InventorsMartin C. Hawley, Jes Asmussen, Jr., Jianghua Wei, Trent A. Shidaker
Life of this patent
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Abstract
A method and apparatus for liquid thermoset resin or polymer molding using electromagnetic waves (particularly radiofrequency waves or microwaves), is described. The method and apparatus uses a metal mold (10, 212) with a cavity (401) for the molding as well as for confinement of the electromagnetic waves. Multiple low loss ports (A, B, C, D, E, p1, p2, p3) are provided for introducing the microwaves into the cavity.
Claims8
An apparatus for forming a cured resin article which comprises:
- (a) a mold with metal walls defining a cavity, with an injection port for introducing a curable liquid polymer composition into the cavity, with means for removing gas from the mold before or during the injection and with multiple ports with apertures into the mold for introducing electromagnetic waves selected from the group consisting of electromagnetic waves and microwaves into the cavity;
- (b) dielectric covers over the apertures of the ports which act as barriers to the resin to be cured in the cavity and which allow transmission of the electromagnetic waves into the cavity;
- and
- (c) multiple applicators mounted over selected of the ports for introducing the electromagnetic waves separately into the cavity through selected of the multiple apertures of the ports and dielectric covers so that the electromagnetic waves provide uniform curing of a liquid resin in the cavity of the mold to produce the article.
1 more element
Dependencies are inferred from the claim text.